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Kostek Systems, Inc.-코스텍시스템㈜

发布时间:2019-03-29 10:51
作者:福唐激光

We serve you as VIP of Kostek Systems.

Through our own technology, we are producing wafer bonding system for essential process of semiconductor & LED

and also producing some equipment for semiconductor’s manufacturing area.
Through the opportunity of this China 2019 show, we want to make progress with you.

Products
- Wafer Bonding System (Temporary Wafer Bonding / De-bonding System for TSV, FOWLP, Micro LED and Mini-LED)
- Chip Transfer System for Micro LED and Mini LED
- Laser Hybrid Bonding System for Micro LED and Mini LED
- Vacuum Cluster Tool / EFEM / N2 Purge LPM / Robot, etc.

Especially, we developed and applied Temporary wafer bonding system for the first time in Korea.
Come and experience the technological solutions you have and the advanced skills of the Kostek Systems.

激光加工服务-首选-福唐激光-一站式服务平台:

品类全、精度高、质量好、价格优惠、交期及时!

新用户首次体验享500元优惠!

福唐智能-激光加工-激光智能制造云商平台

福唐红中国红,苏州福唐智能科技有限公司是一家高科技智能制造企业,首创ASM概念,贯通激光加工脉络,提供一站式数字化激光加工服务,是您值得信赖的工业互联网激光云平台。已创立福唐星公益《关爱下一代做更有爱的家长》传播梦想之爱,铸造品牌形象,传播激光之美,引领科技亲子,铸就福唐梦中国梦。

标签:Laser Hybrid BondingMicro LED and Mini L

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