Veeco designs, manufactures and markets thin film process equipment that enables high-tech electronic device production and development all over the world.
Veeco’s proven metal organic chemical vapor deposition (MOCVD), molecular beam epitaxy (MBE) lithography, laser spike annealing, ion beam, single wafer etch and clean technologies play an integral role in producing LEDs for solid-state lighting and displays and in the fabrication of power electronics, photonics, optics and advanced semiconductor devices. The company also offers solutions to the semiconductor wafer inspection market that leverages proprietary coherent gradient sensing (CGS) technology, and provides atomic layer deposition (ALD) tools to leading research organizations.
he LSA101 system enables critical millisecond annealing applications that allow customers to maintain high processing temperatures, and thus achieve improved device performance, lower leakage, and higher yield.
Utilized by leading IDMs and foundries around the globe, Veeco’s LSA101 Ultratech System is utilized as the preferred technology for high-volume manufacturing of advanced logic devices from the 40nm to 14nm nodes. Built on the customizable Unity Platform™, the LSA’s scanning system has fundamental advantages in uniformity and low-stress processing, which make it readily applicable for current and future device nodes. The LSA101 system enables critical millisecond annealing applications that allow customers to maintain high processing temperatures, and thus achieve improved device performance, lower leakage, and higher yield.
The standard LSA101 configuration utilizes a single narrow laser beam to heat the wafer surface from substrate temperature to the peak annealing temperature. An LSA dual beam technology was developed to expand the application space of non-melt laser annealing and features a second low-power laser beam to enable low-temperature processing. When using dual beam a second wider laser beam is incorporated to preheat the wafer. The dual beam system offers flexibility in tuning the temperature and stress profiles.
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