海德堡仪器
Heidelberg Instruments
德国
光学 | 光刻机
德国海德堡仪器公司始建于1984年，现已发展成为集研发和制造并做为基于非掩膜正交系统技术下利用复杂激光去完成微米级图形的绘制方面的领军企业，这些系统可应用于集成电子领域的高精度光掩膜版制作，平面显示技术，MEMS，以及微米乃至纳米级的微光路。
德国海德堡仪器公司的客户包括了全球主要的以微米，纳米技术为研究方向的科技公司，以及在电子，通讯，和信息技术方面最前沿的研究机构。
德国海德堡仪器公司位于德国海德堡市，并且在亚洲，欧洲，和北美洲都设有客户服务办公室。
中国分公司：德商海德堡激光技术（深圳）有限公司
Heidelberg Instruments designs, develops, and manufactures maskless laser lithography systems for the fabrication of micro-structures, serving the global photolithography community in both the direct writing field and in photomask production. Application areas include MEMS, micro-optics, advanced packaging (3DIC), IC, flat panel displays (FPD), micro-fluidics, sensors, and other analog and digital electronic components. Our systems are used in more than 50 countries in Research and Development, rapid prototyping, and industrial production.
In 2018, Heidelberg Instruments was joined by SwissLitho, a young and innovative high-tech company with an expertise in Scanning Thermal Probe Lithography (STPL), a technology realized with their NanoFrazor systems. Together, Heidelberg Instruments and SwissLitho are now able to provide customers with an additional choice of tools and options in the Nano- and Microlithography field. In the NanoFrazor, heatable silicon tips are used for direct patterning of arbitrary 2D and 3D nanostructures and for simultaneous imaging of the tiny resulting nanostructures.
发展历史：
A MODEST BEGINNING
Researchers from the University of Heidelberg and the European Molecular Biology Laboratory (EMBL) establish Heidelberg Instruments GmbH with focus on biomedical optics, confocal microscopy as well as wafer patterning and inspection.
REBRANDING
The company becomes independent with new ownership and is renamed Heidelberg Instruments Mikrotechnik GmbH. The company shifts its core business towards lithographic patterning tools for the semiconductor industry.
FIRST DWL SYSTEM
The company launches its first direct write laser lithography system. The DWL 66 is a system specifically designed for low-volume, high-precision direct patterning for scientific research.
OEM AGREEMENT
Heidelberg Instruments and Gerber System Corporation launch their long-term development cooperation for large-area exposure systems.
FIRST STEPS BEYOND NATIONAL BORDERS
Heidelberg Instruments expands to Asia and North America. First subsidiaries are founded to supply the emerging markets.
CONTINUED GROWTH
The company increases its exports and production capacity to meet higher demand. In 2005, a new 2,500-square-meter-production building is inaugurated in Heidelberg.
SMALLER FOOTPRINT
The µPG 101 is rolled out. The company’s first tabletop direct-write lithography system is designed to provide an easy and fast way to create microstructures for universities and research institutes.
EXPANDING THE PORTFOLIO
Heidelberg Instruments introduces the VPG line of large-area lithography systems in response to growing demand for high-end photomask production. In 2013, the company adds the VPG 200/400 family of systems to its product range.
500TH INSTALLATION
The 500th system leaves the production line.
PROCESS AND APPLICATION LAB
The company establishes an additional Process and Application lab in China in addition to the primary location in Heidelberg, Germany.
NEW PARTNER
RAG-Stiftung Investment Company acquires 100% of Heidelberg Instruments. The company invests into specialized medium-sized companies in the fields of mechanical engineering, automation and industrial technologies serving international growth segments.
MLA SERIES
The product range grows again with the introduction of high-performance maskless aligner systems called the MLA series. The tools are designed to be a direct alternative to mask aligners, eliminating the need for photomasks.
EXPANSION
Heidelberg Instruments buys the majority stake in the Swiss-based nanotech company SwissLitho, a manufacturer of nanolithography systems. The worldwide workforce grows to around 250 employees.
PRODUCT PORTFOLIO GROWS
New products are introduced: The NanoFrazor Explore (now equipped with a laser writer module), the new µMLA table-top maskless lithography system, and the economic semiconductor mask writer ULTRA.
产品介绍
The DWL 2000 and 4000 laser lithography systems constitute fast, flexible high-resolution pattern generators, capable of the Professional performance level of Grayscale Lithography. The latter allows the creation of complex 2.5D structures in thick photoresist over large areas. Most common applications of the Grayscale exposure mode include the fabrication of wafer level optics used for telecommunication or illumination market segments; it is also used in display manufacturing, and in device fabrication in Biology and the Life Sciences.
In addition to Grayscale, the DWL series tools excel at binary 2D exposures, down to the highest resolution with a minimum feature size of 500 nm. With a write area of up to 400 mm x 400 mm and the optional automatic loading system, these systems provide the perfect solution if you require high-throughput patterning of masks and wafers in MEMS, BioMEMS, Micro Optics, ASICs, Micro Fluidics, Sensors, and CGHs.
DWL 2000
DWL 2000 是一种高速，高适应性，高精度的掩模激光直写系统。除了擅长绘刻各种2D图形，也可以在厚胶板材上绘刻3D图形。
刻写最大面积达到200 x 200 mm2 ，该系统是MEMS, BioMEMS, Micro Optics, ASICs, Micro Fluidics, Sensors, CGHs及其它需要刻画微观结构应用的首选.
KEY FEATURES
产品应用领域介绍：
SQUID ARRAY -ATOMIC MEMRISTORS -PHOTONIC MOLECULES
Research and development activities on quantum devices are strongly growing worldwide. Future quantum devices promise to revolutionize computing, sensing and data communication. Prototypes and ideas for quantum devices are very diverse and based on a wide variety of particles and quasi particles and their specific properties and interactions.
Devices made of 2D materials and their stacks often exhibit interesting physics. Impurities and defects, however, can limit performance of such devices.
EXCELLENT ELECTRICAL CONTACTS TO MOS2-GERMANIUM NANORIBBON DEVICES-LOCATING AND SHAPING 2D MATERIALS
Handling small volumes of liquids in nanofluidic channels is often used in nano- and biotechnology. The applications range from DNA sequencing to sorting, assembling and manipulating nanoparticles, proteins, enzymes or viruses.
BROWNIAN MOTORS-BASED NANOPARTICLE SORTING DEVICE-ULTRA-HIGH RESOLUTION ENZYME ASSEMBLY-BIOMIMETIC TOPOGRAPHY WITH NANOMETER PRECISION FOR STEM CELL RESEARCH
The study of microfluidics may either serve to replicate real-world reactions or enable detection of smallest amounts of substances. A prime example is the “lab-on-a-chip”: Chemical or biological reactions are “miniaturized”, thereby enhancing efficiency and enabling application in constricted conditions. Some microfluidic chips serve as sensors, while so-called “bio-chips” are used for protein or DNA analysis, or allow for diagnostics of microscopic blood samples.
MICROFLUIDIC MIXER-MICROFLUIDIC DEVICE
Moore’s law has pushed the specs of today’s transistors to a level that is often beyond reach for conventional direct-write nanolithography. The high throughput manufacturing technologies like EUV or DUV multi-patterning are too expensive for an efficient exploration of new promising materials and designs promising for next generation chips especially for “Beyond Moore” devices. Alternative rapid prototyping methods are required for the development of such novel nanoelectronic devices.
SILICON FINS-SINGLE-ELECTRON TRANSISTORS-ATOMIC MEMRISTORS-INAS-NANOWIRE TRANSISTORS
Micro-lens arrays and complex Fresnel lenses have become a key element of any compact camera optics, and the evolution of smartphones and tablets is driving the demand for ever more advanced and miniaturized optics. In addition, micro-lenses are used in wave-front sensors, for fiber coupling, or for homogenizing light sources.
Grayscale Lithography is essential for the creation of such state-of-the-art technologies: With it, the molds are generated. Those then are replicated by LIGA to create a metal shim, which in turn is used as a master tool to create replications by molding, imprinting or hot embossing.
Aside from lenses, Grayscale Lithography is utilized to fabricate a multitude of other micro-optical components. Examples are micro prisms, waveguides, blazed gratings or micro-mirrors. In addition, Computer Generated Holograms (CGH) and special security labels are other applications where Grayscale Lithography excels.
Due to the strict requirements in the fabrication of diffraction gratings, standard methods like interference lithography are often not applicable. Direct Write Lithography on the other hand allows fast and precise manufacturing of VLS and standard gratings.
Our DWL series includes a variety of high-performance Grayscale systems: The DWL 66+ represents the ideal Research & Development tool, offering all levels of Grayscale Lithography and a multitude of options. The top-end DWL series (2000 and 4000) comes equipped with air-bearing stage. professional Grayscale package, and high accuracy features as standard.
BLAZED GRATINGS-TEXTURED SURFACES AND DECORATIVE EFFECTS-DIFFUSERS AND REFLECTORS-MICROLENSES, MICROLENS ARRAYS-MICRO-LENSES, MICRO-LENS ARRAYS-DIFFRACTIVE OPTICAL ELEMENTS (DOE)-FRESNEL LENSES
When going to small dimensions, material properties change depending on the size and shape. Direct write lithography is a versatile technique for modifying and shaping materials at the nano- and microscale to study and control a wealth of physical properties.
Direct laser lithography can be used to create microscale patterns, structures and textures as well as contacts for electronic devices and measurements. Thermal lithography can do the same on the nanoscale and also directly generate various material modifications by local heating. Moreover, states of matter that are not accessible macroscopically can be reached thanks to ultra-fast heating or cooling, and high local pressure that can be applied with the nanoscale heated tip of the NanoFrazor.
MEASURE NANOWIRE PROPERTIES-NANORIBBON ARRAYS IN 2D MATERIALS-FERROELECTRIC NANOSTRUCTURES-QUENCHING OF FLUORESCENT SUPRAMOLECULAR POLYMER-SURFACE PATTERN
MEMS (Micro-Electro-Mechanical Systems) are devices that consist of micro system components with dimensions in a range of 1 µm to 100 µm. MEMS facilitate the miniaturization of existing devices, provide new functionality using physical principles that do not work at larger scale, and enable development of tools to operate in the micro-world. MEMS may present as complex machines such as sensors or actuators, or as simple structures like cantilevers, gearwheels or other mechanical parts.
Well-known examples are accelerometers, gyroscopes, pressure sensors, biosensors, micro pumps, micro valves etc. A subsection of MEMS are MOEMS (Micro-Optical-Electrical-Mechanical-Systems) devices, which combine MEMS with Micro-Optics: for example optical switches, optical modulators, or optical interconnects.
The fabrication of MEMS is based on semiconductor process technology, consisting of deposition of material layers, patterning by photolithography, and etching to produce the required shapes.
Bulk Micromachining is a technology where the whole thickness of the silicon is used to build microstructures by applying various etching processes. For all fabrication methods, be it bulk or surface micromachining, lithography is required to create etch mask on silicon or high-aspect ratio structures in thick photoresists. Here, our Direct Write Lithography is the ideal technology to accomplish rapid prototyping of MEMS devices.
HIGH-ASPECT RATIO GEAR WHEEL-MICRO GEARWHEELS
Nanoimprint lithography (NIL) replicates 2D or 3D nanostructures with high throughput for photonics, optics and nanofluidics applications. This method relies on high-precision master templates prepared by direct-write nano- or microlithography.
HIGH-FIDELITY 3D REPLICAS FROM NANOFRAZOR PATTERNS-STEP-AND-REPEAT NIL WITH NANOFRAZOR-PATTERNED TEMPLATES-AMPLIFICATION OF 3D PATTERNS BY ETCHING-REPLICATION OF HIGH-RESOLUTION FEATURES-LARGE AREA MASTERS
In electronics manufacturing, integrated circuit (IC) packaging is the final stage of semiconductor device fabrication. The integrated circuit is encapsulated in a supporting case, known as a "package", which supports the electrical contacts which connect the device to a circuit board.
The huge variety of ICs in the semiconductor industry all have different packaging requirements: The package type for a particular device depends on different parameters including size, power dissipation, field-operating conditions, and cost. Advanced packaging technologies include BGA, Flip-Chip, CSP, LGA, and PGA.
Multi-chip modules, systems-in-package, as well as heterogeneous integration of dissimilar chips or sensors allow higher integration densities compared to multiple chips on a conventional printed circuit board (PCB). These packages offer advantages in terms of speed, cost, functionality, and ease of integration for system designers.
Depending on packaging method and the technical requirements, different materials need to be structured to implement the required fan out and mapping of the IC contact pads. The materials range from silicon (through-silicon vias) to polymers to ceramics to metals.
What these all have in common is the requirement for a flexible and high-resolution lithography technology. Heidelberg Instruments’ VPG+systems are designed for flexible production applications and offer high throughput, automatic distortion compensation, and focus following for substrates with low planarity.
ADVANCED PACKAGING
A photomask displays the pattern of an integrated circuit and works as a template in the photolithographic production of the resulting device. Masks are used in the fabrication of high-end electronic components, semiconductor devices, or displays. Even though transistors are becoming smaller and smaller, photomask-based UV lithography is still the industry-standard workhorse for micro-fabrication.
A photomask usually consists of a metal covered soda-lime or quartz plate with transparent openings. The metal absorbs the light at different wavelengths: Standard masks use chrome as absorption material for i-, g- and h-line. The transparent image on the photomask represents the master template, the pattern which is transferred by a mask aligner or stepper into a photosensitive layer by photolithography. For semiconductor or display applications a whole set of photomasks is required to produce the complete device. For semiconductor manufacturing the photomask is protected by a foil (pellicle) to avoid any contamination.
The image on the photomask is patterned by laser lithography or e-beam depending on the requirements. A a master template for photolithographic manufacturing, the mask has to fulfill stringent requirements. Those include key specifications like linewidth uniformity, pattern position accuracy, edge roughness and minimum feature size. In addition, to enable a large process window for the final process, the photomask specifications have to be considerably better than the target application.
PHOTOMASKS FOR ADVANCED PACKAGING APPLICATIONS-PHOTOMASK STRUCTURES-PHOTOMASKS PRODUCED BY EMULSION LITHOGRAPHY
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