激光隐形切割-Stealth Dicing-硅片-晶圆-蓝宝石-玻璃

激光隐形切割-硅片-晶圆-蓝宝石-玻璃

What is Stealth Dicing™ treatment?

"Stealth Dicing™ treatment" forms a modified layer in the workpiece by focusing a laser inside the workpiece, and then a tape expander is used to separate the die.

Merits of Stealth Dicing™ Treatment

Able to suppress cutting waste because it modifies an internal portion of the workpiece. Therefore, it is suitable for workpieces that are vulnerable to contamination.

It is a dry process that does not require cleaning, therefore it is suitable to processes (such as MEMS) that are vulnerable to load.

Greatly contributes to street reduction because the kerf width can be made narrow.

Street reduction

Stealth dicing is expected to increase the number of die that can be obtained from a wafer compared to normal dicing because it is possible to make the necessary street width (cut width) narrower. This is a particularly effective processing method for long shaped die, such as line sensors.

Comparison of the number of die that can be obtained from one wafer

The number of die obtained from one wafer increases by reducing the street width on a wafer with long-shaped dies.

Examples

MEMS dicing

The profile of a MEMS die, such as one with a hollowed structure, or one that is already embedded with complicated minute elements, is generally not strong enough for cleaning water or the dicing load. Stealth dicing can be expected to result in high-quality processing of MEMS because it does not use water for processing or cleaning, and there is little or no damage to the die front or back surfaces.

- Processing irregular shaped die

This cutting method can efficiently process workpieces like polygon shaped die, such as hexagons and octagons. Depending on the conditions, it is also be possible to process irregular shaped die.

Hasen Cut

A Hasen Cut is a method that cuts while repetitively turning the laser ON/OFF at a set cycle during laser processing. It is possible to process various shapes depending on the ON/OFF setting.

Hasen Cut application example

- Systematic complex die size wafer cut

By using the Hasen Cut, it is possible to process a wafer with combinations of irregular die shapes that could not be realized with the existing laser full cut processing or a blade dicer.

- Die offset processing

By applying the Hasen Cut, the dicing street can also support intermittent die layout, as shown in the illustration below. This is effectively useful for large die sizes, high-priced wafers or long die, and enables increasing the number of die that can be obtained.

新技术研发：

激光切割是半导体加工领域常用的手段，尤其是对半导体基板或晶圆进行单体化切割。在现有的晶圆级芯片封装结构(WLCSP)中，为了满足小尺寸发展的需求，会在晶圆级芯片封装结构中使用低k介质层(譬如，重新布线层)，以及在后续要进行激光切割(lasersaw)或刀片切割(blade saw)；但由于低k介质层比较脆，切割过程会导致重新布线层碎裂或者剥离。现有技术往往会通过两次切割来保护低k介质层，即先切割低k介质层，再进行切割晶圆，以防止低k介质层的碎裂或剥离。激光隐形切割能否微Low-k切割带来新的技术创新点，敬请期待。

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