激光设备公司
晶圆激光打标机详细参数
商品规格
Commodity Specification
序号 No | 项目 Item | 设备描述 Description |
商品 Commodity | 产品名称:晶圆打标机 Commodity name: Wafer Laser machine 型号Model: FTR-200I | |
技术规格Technical Specification | 全封闭机柜Fully enclosed frame | |
晶圆尺寸Wafer Size:≤8inch | ||
专用字体Semi Font: 支持 | ||
加工幅面Working area:>100*100mm | ||
高精度扫描系统High accuracy scan system | ||
定位精度Positioning accuracy: ≤±5μm | ||
重复定位精度Repeatability positioning accuracy: ≤±2μ | ||
打标速度Marking speed : >7000mm/s | ||
支持最小字符Minimum size of context:≤0.5mm | ||
支持最小二维码Minimum size of 2D code:≤0.5*0.5mm | ||
支持DXF等软件格式和在线编辑功能 Support DXF software type and online edit function | ||
调焦系统Laser focus adjustment system:支持 | ||
专用吸尘系统Vacuum clean system | ||
配有真空吸附平台Vacuum table | ||
激光器指标 Laser specification | 激光波长Laser wavelength:1064nm | |
激光器平均功率Laser average power :20W | ||
激光脉冲宽度Laser pulse width:<50ns | ||
激光器频率Laser frequency:20KHz-200KHz | ||
激光模式Laser Mode:TEM00 | ||
激光功率波动范围Laser power Stability:<3% | ||
安全模组 Safety module | 激光安全互锁装置Safety interlock for laser | |
安装光幕防护系统Safety light curtain module |
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