DWL2000  DWL4000

https://heidelberg-instruments.com/en/

德国海德堡 激光直写光刻机DWL 66+科研用激光直写系统
具有多种直写模块，实现不同精度直写需求
能于结构上进行灰度曝光

DWL 66+激光光刻系统是具经济效益的高分辨率图像产生器，适用于小批量掩模板制作和直写需求。该系统的功能和灵活性使其成为Life Science, Advanced Packaging, MEMS, Micro-Optics, Semiconductor以及所有其他需要微结构应用的刻研工具。DWL 66+的客户群包括全球200多所顶尖大学和研究机构，许多系统功能是与这些机构合作开发，及先进技术不断改进以增加高分办率：DWL 66+的最小结构尺寸为300 nm，提供了极高的分辨率，优于或等于研发领域中最强大的光学光刻系统。

基本的DWL 66+包含创造和分析微结构所需的所有功能。它可以用于掩模板制作或直写在任何涂有光刻胶的平坦材料上，多样化选择可提高灵活性，使系统适用于更多应用领域。

德国海德堡Heidelberg 激光直写光刻机 MA100

MLA150无光罩激光直写设备

NanoFab Tool: Heidelberg Instruments DWL 2000 Laser Pattern Generator

The Heidelberg Instruments DWL 2000 Laser Pattern Generator uses a high resolution laser to expose photoresist for substrate patterning of features as small as 700 nm. The system can be used both for patterning chrome on glass photomasks and for maskless direct substrate writing. The laser writer can process substrates up to 200 mm in diameter and 7 mm thick. Standard processes include photomask patterning for use in both contact and stepper lithography.

SPECIFICATIONS/CAPABILITIES

• Laser wavelength: 405 nm.
• Minimum feature size: 700 nm.
• Write speed: 110 mm² / min.
• Address grid: 20 nm.
• Patterning to substrate edge with optical autofocus.
• Allowed data formats: DXF, GDS-II, CIF, and Gerber.
• Alignment system for exposing patterns on existing structures.
• Closed loop environment system.

• USAGE INFORMATION

  Supported Sample Sizes

  • Maximum wafer diameter: 200 mm (8 in).
  • Maximum substrate thickness: 7 mm.
  • Small pieces supported: Yes.
  • Photomask blank sizes provided: 125 mm (5 inch) and 150 mm (6 inch).

• TYPICAL APPLICATIONS

  • Micrometer and sub-micrometer lithography.
  • Photomask patterning for:
    • Contact lithography.
    • Stepper lithography.
  • Direct substrate patterning (maskless lithography).
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https://www.nist.gov/laboratories/tools-instruments/

ABOUT HEIDELBERG INSTRUMENTS

Heidelberg Instruments designs, develops, and manufactures maskless laser lithography systems for the fabrication of micro-structures, serving the global photolithography community in both the direct writing field and in photomask production. Application areas include MEMS, micro-optics, advanced packaging (3DIC), IC, flat panel displays (FPD), micro-fluidics, sensors, and other analog and digital electronic components. Our systems are used in more than 50 countries in Research and Development, rapid prototyping, and industrial production.

In 2018, Heidelberg Instruments was joined by SwissLitho, a young and innovative high-tech company with an expertise in Scanning Thermal Probe Lithography (STPL), a technology realized with their NanoFrazor systems. Together, Heidelberg Instruments and SwissLitho are now able to provide customers with an additional choice of tools and options in the Nano- and Microlithography field. In the NanoFrazor, heatable silicon tips are used for direct patterning of arbitrary 2D and 3D nanostructures and for simultaneous imaging of the tiny resulting nanostructures.