陶瓷以其独有的硬度和电特性，在军民领域均发挥重要的作用，天然的硬，意味着一般的工艺很难加工陶瓷，激光作为先进制造技术，利用高峰值功率可以完美的解决进行陶瓷加工。
玻璃属于硬脆材料的一种，传统机械加工容易产生内部应力，从而导致碎片，激光经过多年的发展，成功解决了用激光加工玻璃的难题，激光加工玻璃是无接触加工，不产生机械应力，加工精度高，崩边尺寸小，在一些应用方面优于传统加工方法。
Laser lift-off is an enabling technology for microelectronics growth markets such as light emitting diodes, densely packaged semiconductor devices, and flexible displays. For example, thin film transistor structures fabricated on top of polymer layers spun on glass carriers must be delaminated from rigid substrates to create lightweight and rugged flexible displays on polymers. Low-thermal-budget processes are generically required to protect adjacent functional films. Excimer lasers provide short UV wavelength and short pulse duration required for highly-localized energy coupling. The high output power of excimer lasers enables a large processing footprint and the high-throughput rates needed in mass manufacturing.
